
ESD3V3U1U Series
Package Information
6.2
Top view
-0.03
0.39 +0.01
Bottom view
0.05 MAX.
Cathode
0.6 ±0.05
2
1
0.5 ±0.035 1)
marking
1) Dimension applies to plated terminal
TSLP 2 7 PO V02
Figure 15
PG-TSLP-2-7: Package overview
0.6
0.45
Figure 16
Copper
PG-TSLP-2-7: Footprint
Solder mask
Stencil apertures
TSLP-2-7-FP V01
Orientation
marking
4
0 .76
0.5
TSLP-2-7-TP V03
Figure 17
Figure 18
PG-TSLP-2-7: Packing
PG-TSLP-2-7: Marking (example)
Final Data Sheet
16
Revision 1.0, 2011-04-12